ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,039, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Bonding apparatus and bonding method" was invented by Hideyuki Fukush... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,040, issued on July 14, was assigned to NGK INSULATORS Ltd. (Nagoya, Japan). "Group-III element nitride semiconductor substrate" was invent... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,041, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Methods of forming superlattice structures using nanopa... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,042, issued on July 14, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and NATIONAL YANG MING CHIAO TUNG ... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,043, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Reactive-ion deposition processes for dielectric mat... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,044, issued on July 14, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Method of manufacturing semiconductor device, method of processing... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,045, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Deposition of oxide thin films" was invented by Suvi P.... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,046, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Doped silicon oxide for bottom-up deposition" was in... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,047, issued on July 14, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Atmospheric pressure plasma for substrate annealing"... Read More
ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,048, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More